Different Types of BGA (Ball Grid Array) Packages

The ball grid array, or the BGA, is an array of small-sized conductor balls arranged in the harmony form on the board used for making the printed circuit boards. Due to the increasing demand for ball grid arrays, many companies now make only BGA. These balls connect using precise and small smoldering while putting the integrated circuits and microprocessors to make the complete circuit we intend to make. The whole process of connecting the ball grid array is called SMT.

What Is BGA?

Ball Grid Array is a common mount package derived from the PGA or pin grid array technology. It utilizes the solder balls to conduct the electrical signals from the integrated PCB. Instead of pins in the PGA, the ball grid array uses the soldering balls placed on the PCB. By using the conductive printed wiring, the PCB supports and forms a connection with the electronic components.

The PGA has hundreds of pins which make soldering difficult. The BGA’s soldering balls are spaced evenly apart without bridging them together. The soldering balls are placed at the bottom of the package and heated. With the help of surface tension during the melting process of soldering balls, the package is aligned with the PCB. The soldering ball will cool down and becomes solid with consistent and accurate distances between the balls.

BGAs are made with insulation and conductive layers with a soldering mask that is green in color. Other colors are blue, black, red, and white. The conductive layers are thin copper foil, which can be specified in ounces per square foot. 

Why BGA Is Famous In Modern Technology?

There are many reasons why many modern technologies depend on the ball grid array. The imperative reason is that the ball grid array has the superlative thermal dissipation capability, which makes the core to be cooled down during the operation. It, in turn, prolongs the lifetime of the product. Heat is the most critical measure for dealing with the ball grid array, which is why many tech products work smoothly at normal temperatures.

Another reason for the popularity of the package BGA is its electrical properties. The shortest distance connections with lower resistive ways make using ball grid arrays even more worthy and valuable. 

The third most important reason is compatibility. Using the smallest space when working with greater balls will allow the manufacturer to place more workable options in the digital product, making it even more valuable. It is connected to lower production costs while producing valuable and better products for the market customers.

Types Of BGA

Many types of BGA are used in many parts of the world by the majority of manufacturers, but the most famous ones are mentioned in the following:

PGBA

Also is known as a plastic ball grid array. It is the most famous type for double-sided PCBs. Motorola invented it, which is now widely used by most worldwide manufacturers. The core is the BT resin used as the substrate material. With the application of the over-molded pad array carrier sealant tech, this is highly reliable and verified by the JEDEC. Such Ball grid arrays carry starting from 200-500 balls.

CBGA

Ceramic Ball grid array, this BGA packaging is made up of ceramic. The ratio between lead and tin is 10:90. It has a high melting point and needs a C4 approach to bridge the PCBs and BGAs. It is a bit more costly than the plastic variant but is highly reliable and provides better electrical performance and thermal conductivity.

TBGA

The only drawback of the TBGA is its high cost. Still, when you want to make thin products with strong core materials, better heat dissipation, and better electrical connectivity properties, you should choose only this type of ball grid array. Whether the chips should be faced up or down is better for making the products valuable while minimizing costs.

EBGA

Enhanced ball grid array is the summation of the plastic alternative and has additional heat sinking options. Around the chips or electrical components on the substrate, the dam is built on the boundaries, and the liquid compounds are then added to seal the components on the BGA packaging. In this, the chips always face down, and the wire bonding is used for the conduction between the chips and PCBs.

FC-BGA

It is very similar to the ceramic BGA packaging, with the only difference being the ceramic substrate. Rather, BT resin is used in this type of BGA to save additional costs. The primary value lies in the short electrical pathways than other types of BGA. Hence it provides better conductivity and performance. The lead and tin ratio in this type is about 63:37. Another benefit of this BGA is that the chips used on the substrate can be realigned for correcting the position without taking the flip-chip alignment machine approach.

Micro BGA

This type of package, BGA, was invented by Tessera. The chips are down-facing, whereas the substrates are made of packaging tape. The value is in using the elastomer between the chip and the tape, which helps thermal stress expansion. The imperative value of the micro package BGA is that they are called mini-sized. Hence, it allows manufacturers to plan for high-tech and small-sized products. Additionally, it is the core of higher storage products while the pins are low in number. Therefore, with better accessibility, you will get lower liability.

MBGA

In this type, the substrate is made up of ceramic. The chips face down, and the circuits comprise the sputtering coating. Wire bonding is used for making the connections. These ball grid array packages provide good electrical performance and better thermal heat dissipation.

Benefits Of Using Ball Grid Arrays

The following are the benefits of using ball grid array packages:

• High Density

The majority of electronic devices need miniature packages with several pins. Due to this reason, the pin grid array and the SOIC packages were introduced to provide lower track densities. However, many PCB companies face issues, and bridging the pins is the 

Primary issue. With the help of the BGA, this issue was resolved since the solder balls provided needed soldering for holding the package. These solder balls are then placed closer to strengthen the interconnections and decrease the footprint produced by the PCB. The high-density connections the ball grid arrays provide make it possible to use PCBs more effectively.

• Reliable Construction

The pins that are used in the PGA packages are fragile and thin. Hence, these pins are damaged and bent easily. However, it is not the issue with the BGA packages. In this, the solder pads are directly connected to the soldering balls, which makes the system even more reliable.

• Reduced Overheating

BGA packages have many thermal channels that absorb heat within the integrated PCB. It primarily reduces overheating chances.

• Excellent Performance

In the ball grid arrays, the solder balls are placed closely. It allows for close bonding amongst the components, reduces signal distortions, and strengthens the interconnections during high-speed work. It means the system offers higher electrical performance at a robust speed. 

Conclusion

BGAs are the core products you will need for electrical devices. This article lets you choose the best type of BGA and integrate it effectively into your product. Many companies are famous for providing the best ball grid arrays according to your needs and preferences.